Technology / Company Certificate
SSP R&D Center's research and development performances.
| Patent No | Name of Invention | View |
|---|---|---|
| 10-0830224 | Dipping device of semiconductor die bonding apparatus |  |
| 10-0865766 | Semiconductor die ejecting apparatus | |
| 10-0889040 | Flipper of semiconductor die bonding apparatus | |
| 10-0915592 | Focusing apparatus of high resolution camera module and focusing method using the same | |
| 10-0961690 | Round dispensing device for manufacturing camera module and round dispensing method using the same | |
| 10-0990886 | Parts supply device of automatic apparatus | |
| 10-0990887 | Clip opening and closing device for clip type carrier boat | |
| 10-0993888 | Solder ball bumping unit and wafer bumping apparatus comprising the same, and bumping method using the same | |
| 10-0998255 | Solder ball mount apparatus which improves productivity and method of solder ball mount using the same | |
| 10-1005098 | Solder ball bumping unit comprising rotating means and wafer bumping apparatus comprising the same, and bumping method using the same | |
