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COMPANY
Message from CEO
Management Philosophy
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Partner Company
Locations
PRODUCT
BALL PLACEMENT SYSTEM
PACKAGE EMI SHIELDING SYSTEM
CAMERA MODULE ASSEMBLY SYSTEM
PROCESS AUTOMATION SYSTEM
PACKAGE SORTER P&P SYSTEM
TOOL & OTHERS
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Introduction of R&D Center
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CONTACT
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Global Network
PR
Media Report
Notice
E-Brochure / Video
RECRUIT
Concept of Talent
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Job Application
COMPANY
Message from CEO
Management Philosophy
QESH Management Policy
Code of Ethics
History
Partner Company
Locations
PRODUCT
BALL PLACEMENT SYSTEM
PACKAGE EMI SHIELDING SYSTEM
CAMERA MODULE ASSEMBLY SYSTEM
PROCESS AUTOMATION SYSTEM
PACKAGE SORTER P&P SYSTEM
TOOL & OTHERS
R&D
Introduction of R&D Center
Major Research Activities
Technology / Company Certificate
CONTACT
Online Inquiry
Global Network
PR
Media Report
Notice
E-Brochure / Video
RECRUIT
Concept of Talent
Education System
Welfare Benefits
Recruit FAQ
Job Application
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R&D
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Technology / Certificate
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SSP R&D Center's research and development performances.
Patent Certificate
Design Registration Certificate
Utility Model Registration Certificate
Main Certificates
Patent No
Name of Invention
View
10-1162625
Ball mount apparatus comprising inkjet type flux tool
10-1170985
Transferring device comprising aligning means and transferring method using the same
10-1410171
Wafer bumping apparatus and bumping method using the same
10-1420185
Electronic part test handler and method of inspecting residual part using the same
10-1475886
Ball supplier and solder ball bumping method using the same
10-1502150
Solder ball supplier
10-1502151
Solder ball supplier using wire brush
10-1550688
Solder ball supplier using air curtain
10-1604582
A device for coating semiconductor packages
10-1621667
A carring and arranging apparatus using multi picker and preciser
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