Technology / Company Certificate
SSP R&D Center's research and development performances.
| Patent No | Name of Invention | View |
|---|---|---|
| 10-1740392 | Flux printing equipment of squeegee rotate type |  |
| 10-1738511 | Solder ball mounting equipment with extra ball removal and scattering prevention function | |
| 10-1790546 | Pick and place system for wafer ring frame type | |
| 10-1762647 | Bumping tool manufacturing method for micro solder ball | |
| 10-1762644 | Semiconductor package manufacturing system and method for reworking at the unit level | |
| 10-1799386 | Tape remove module for semiconductor package protection tape remove equipment | |
| 10-1752202 | Solder ball loading equipment of double air curtain structure | |
| 10-1786789 | Vacuum adsorption plate for wafer stage | |
| 10-1842967 | Detaping module for semiconductor package protection tape | |
| 10-1862663 | Interface automatic changing method of display for semiconductor equipment | |
